Lenovo eServer BladeCenter HS22V Manual
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High-performance blade server optimized for virtualization
Please see the Legal Information section for important notices and information. 1.
Product Guide
October 2010
IBM BladeCenter HS22V
Product Overview
CONTENTS
Product Overview 1
Selling Features 2
Key Features
4
Key Options 1
4
HS22V Images 16
HS22V Specifications 16
The Bottom Line 19
Server Comparison 20
For More Information 21
Legal Information 21
High density, high performance 2-socket blade server optimized for
virtualization
Suggested uses: Mainstream virtualization and memory-intensive HPC applications requiring
high memory density, outstanding performance, and enhanced power efficiency.
Today’s data center environment is tougher than ever. You’re looking to reduce IT cost,
complexity, space requirements, energy consumption and heat output, while increasing flexibility,
utilization and manageability through virtualization. Incorporating IBM X-Architecture
™ features,
the IBM® BladeCenter® HS22V blade server, combined with the various BladeCenter chassis,
can help you accomplish all of these goals.
Reducing an entire server into as little as .5U of rack space (i.e., up to 14 servers in 7U) does not
mean trading away features and capabilities for smaller size. Each HS22V blade server offers
features comparable to many 1U rack-optimized full-featured servers: The HS22V supports up to
two of the latest high-performance 6-core/4-core/2-core Intel
® Xeon® 5600 series and 5500
series processors. The Xeon processors are designed with up to 12MB of shared cache and
leading-edge memory performance (up to 1333MHz, depending on processor model) to help
provide the computing power you require to match your business needs and growth. The HS22V
supports up to 288GB1 of registered double data rate III (DDR3) ECC (Error Checking and
Correcting) memory in 18 DIMM slots, with optional Chipkill
™ protection
2, for high performance
and reliability. Selected models are planned for NEBS-3/ETSI-compliance.
The HS22V supports VMware vSphere Hypervisor (formerly ESXi) preloaded on a standard
USB flash drive. It operates in a diskless configuration, offers a smaller memory footprint,
extremely high performance, and stronger security, making getting a system up and running in a
virtualized environment faster and easier than ever before. The HS22V supports approximately
50% more average virtual machines (VMs) than the HS22. With up to 288GB of memory, the
HS22V is an outstanding choice for virtualization, in-memory databases, and memory-intensive
enterprise applications.
An integrated dual-port Gigabit Ethernet
3 controller is standard, providing high-speed data
transfers and offering TOE (TCP Offload Engine) support, load-balancing and failover
capabilities. Via optional expansion cards, each blade can also connect to additional Ethernet,
10Gb Ethernet, Converged Network Adapter (CNA), SAS, Fibre Channel, iSCSI, InfiniBand
™,
and other high-speed communication switches housed in the chassis. This blade is designed with
power management capability to provide the maximum uptime possible for your systems. In
extended thermal conditions or power brownouts, rather than shut down completely, or fail, the
HS22V automatically reduces the processor frequency to maintain acceptable thermal and power
levels.
All HS22V models offer impressive features at an equally impressive price, including up to two
1.8-inch fixed solid-state drives (SSDs) with RAID-0/1 support, and one internal USB flash
drive (for embedded hypervisor]. Additional direct-attach storage is available via the BladeCenter
S chassis. Moreover, the HS22V is optimized for diskless operation, offering each blade server
access to essentially unlimited external storage capacity via Fibre Channel, SAS, or iSCSI.
A single BladeCenter E BladeCenter H or chassis supports up to 14 hot-swappable 30mm-
wide HS22V blades in only 7U (BladeCenter E) or (BladeCenter H) of rack space or up to 9U 12
in the 12U BladeCenter HT high-speed telecommunications chassis. In addition to the blade
servers, these chassis also hold up to 4 switches (BladeCenter E) or up to 10 (BladeCenter H) or
8 switches/bridges (BladeCenter HT) internally. The BladeCenter S, designed for SMB and
mid-market customers, takes integration and affordability to a new level, combining up to 12 hot-
swap SAS/SATA HDDs (with optional SAS card) and up to 6 blade servers and 4 switches. Not
only can this save significant data center space (and therefore the cost of floor space and rack
1 When 16GB DIMMs are available in 4Q/10.
2 Chipkill protection on the HS22V requires x4 DIMMs; Chipkill protection is not available with x8 DIMMs.
3 Actual data transfer speed will vary and is often less than the maximum possible. Gigabit Ethernet transfer speed requires support on both
system and server, and appropriate network infrastructure.
Produkt Specifikationer
Mærke: | Lenovo |
Kategori: | Server |
Model: | eServer BladeCenter HS22V |
Bredde: | 245 mm |
Dybde: | 446 mm |
Højde: | 29 mm |
Vægt: | 5440 g |
Ethernet LAN-porte (RJ-45): | 2 |
Antal USB 2.0-porte: | 1 |
Ethernet LAN: | Ja |
Processorkerner: | 4 |
Intern hukommelse: | 12 GB |
Intel® Wireless Display (Intel® WiDi): | Ingen |
Mac kompabilitet: | Ingen |
Bæredygtighedscertifikater: | ENERGY STAR |
Processorfrekvens: | 3.2 GHz |
Processorserie: | Intel® Xeon® 5000 Sequence |
Processor boost frekvens: | 3.6 GHz |
Processortråde: | 8 |
Processor-cache: | 12 MB |
Processor cache type: | Smart cache |
Intern hukommelsestype: | DDR3-SDRAM |
Hukommelsesur hastighed: | 1066 Mhz |
Maksimal intern hukommelse: | 288 GB |
Samlet lagringskapacitet: | 0 GB |
Intel® Hyper Threading Teknologi (Intel® HT Technology): | Ja |
Intel® Turbo Boost Teknologi: | 1.0 |
Hukommelsesstik: | 18x DIMM |
Processorproducent: | Intel |
Processormodel: | X5672 |
Optisk drevtype: | Ingen |
Enhanced Intel SpeedStep Teknologi: | Ja |
Udfør deaktivering af bit: | Ja |
Idle status: | Ja |
CPU-konfiguration (maks.): | 2 |
Intel® VT-x with Extended Page Tables (EPT): | Ja |
Indlejret tilgængelige muligheder: | Ingen |
Intel® 64: | Ja |
Intel® Virtualization Technology for Directed I/O (VT-d): | Ja |
Intel® Virtualization Technology (VT-x): | Ja |
Grafikadapter: | G200eV |
HDD-grænseflade: | SATA |
Overholdelse af branchestandarder: | IEEE 802.3, IEEE 802.3u, IEEE 802.3ab |
Netværksfunktioner: | Gigabit Ethernet |
Antal installerede processorer: | 1 |
Bus type: | QPI |
Kabinettype: | Blade |
Intel® Flex Memory Access: | Ingen |
Intel® Trusted Execution Teknologi: | Ja |
Intel® Enhanced Halt State: | Ja |
Intel® klar video teknologi: | Ingen |
Konfliktfri processor: | Ingen |
HDD-størrelse: | 1.8 " |
Processor sokkel: | Socket B (LGA 1366) |
Processor litografi: | 32 nm |
Stepping: | B1 |
Thermal Design Power (TDP): | 95 W |
Fejlkorrigerende kode understøttet af processor: | Ja |
Processor front side bus: | 1333 Mhz |
Systembus-hastighed: | 6.4 GT/s |
Processor driftstilstande: | 64-bit |
Processor kodenavn: | Westmere EP |
FSB Paritet: | Ingen |
Intel® InTru™ 3D Teknologi: | Ingen |
Intel® Clear Video HD Teknologi (Intel® CVT HD): | Ingen |
Intel® Insider™: | Ingen |
Intel® My WiFi Teknologi (Intel® MWT): | Ingen |
Intel® Anti-Theft Teknologi (Intel® AT): | Ingen |
Intel® Quick Sync Video Teknologi: | Ingen |
Intel® AES Nye Instruktioner (Intel® AES-NI): | Ja |
Intel® Demand Based Switching: | Ja |
Termiske overvågningsteknologier: | Ingen |
Fysisk adresseudvidelse (PAE): | Ja |
Intel® Dual Display Capable Teknologi: | Ingen |
Intel® FDI Teknologi: | Ingen |
Intel® Rapid Storage Teknologi: | Ingen |
Intel® Fast Memory Access: | Ingen |
Intel® Clear Video Teknologi til MID (Intel® CVT for MID): | Ingen |
Processor-pakke størrelse: | 42.5 X 45 mm |
Processor kode: | SLBYK |
Processor ARK ID: | 52579 |
Hukommelseslayout (slots x størrelse): | 3 x 4 GB |
CPU-multiplikator (bus/kerneforhold): | 24 |
Understøttede instruktionssæt: | SSE4.2 |
Understøtter RAID: | Ja |
Maksimal lagerkapacitet: | 0.1 TB |
Fejlkorrigerende kode: | Ja |
PCI Express x16 slots: | 2 |
Redundant strømforsyning: | Ingen |
Antal understøttede HHD'er: | 2 |
Kompatibel processor serie: | Intel® Xeon® |
Bundkort chipsæt: | Intel® 5520 |
LAN Kontroller: | Broadcom BCM5709S |
Maksimal grafikadapterhukommelse: | 16 MB |
Wake-on-LAN klar: | Ja |
RAID-niveauer: | 0, 1 |
Maksimal intern hukommelse understøttet af processor: | 288 GB |
Hukommelsestyper understøttet af processor: | DDR3-SDRAM |
Hukommelsesurhastigheder understøttet af processor: | 800,1066,1333 Mhz |
Hukommelsesbåndbredde understøttet af processor (maks.): | 32 GB/sek. |
Tcase: | 82.9 °C |
Maksimalt antal SMP-processorer: | 2 |
Grafikadapter familie: | Matrox |
Fysisk adresse udvidelse (PAE): | 40 Bit |
Antal QPI-lins: | 2 |
Antal strømforsyninger: | 1 |
Hukommelseskanaler understøttet af processor: | Tredobbelt |
Disk array controller: | LSI Logic 53C1046E |
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