Supermicro SuperServer SYS-220HE-FTNR Manual

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USER’S MANUAL
Revision 1.0b
SuperServer®
SYS-220HE-FTNR
SYS-220HE-FTNRD
The information in this User’s Manual has been carefully reviewed and is believed to be accurate. The vendor assumes
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:
For the most up-to-date version of this manual, please see our website at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.
IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class A or Class B digital
device pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference when the equipment is operated in industrial environment for Class A device or in residential
environment for Class B device. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the manufacturer’s instruction manual, may cause harmful interference with
radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in
which case you will be required to correct the interference at your own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See ”.www.dtsc.ca.gov/hazardouswaste/perchlorate
WARNING: This product can expose you to chemicals including
lead, known to the State of California to cause cancer and birth
defects or other reproductive harm. For more information, go
to www.P65Warnings.ca.gov.
!
The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical
systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic
property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.
Manual Revision 1.0b
Release Date: July 25, 2022
Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this
document. Information in this document is subject to change without notice. Other products and companies referred
to herein are trademarks or registered trademarks of their respective companies or mark holders.
Copyright © 2022 by Super Micro Computer, Inc.
All rights reserved.
Printed in the United States of America
3
Preface
Preface
About this Manual
This manual is written for professional system integrators and PC technicians. It provides
information for the installation and use of the server. Installation and maintenance should be
performed by experienced technicians only.
Please refer to the SYS-220HE-FTNR/220HE-FTNRD server specifications page on
our website for updates on supported memory, processors, and operating systems
(http:// www. supermicro. com).
Notes
For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.
• Supermicro product manuals: http://www.supermicro.com/support/manuals/
• Product drivers and utilities: https://www.supermicro.com/wdl
• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm
If you have any questions, please contact our support team at:
support@supermicro.com
This manual may be periodically updated without notice. Please check the Supermicro website
for possible updates to the manual revision level.
Secure Data Deletion
A secure data deletion tool designed to fully erase all data from storage devices can be found
on our website: https://www.supermicro.com/about/policies/disclaimer.cfm?url=/wdl/utility/
Log9_Secure_Data_Deletion_Utility/
Warnings
Special attention should be given to the following symbols used in this manual.
Warning! Indicates high voltage may be encountered when performing a procedure.
Warning! Indicates important information given to prevent equipment/property damage
or personal injury.
4
Contents
Contents
Contacting Supermicro ........................................................................................................9
Chapter 1 Introduction
1.1 Overview .............................................................................................................................10
1.2 System Features ................................................................................................................11
Front View .........................................................................................................................11
Control Panel .................................................................................................................13
Rear View ..........................................................................................................................14
1.3 System Architecture ...........................................................................................................15
Main Components .............................................................................................................15
System Block Diagram ......................................................................................................17
1.4 Motherboard Layout ...........................................................................................................18
Quick Reference Table ......................................................................................................19
Chapter 2 Server Installation
2.1 Overview .............................................................................................................................20
2.2 Unpacking the System .......................................................................................................20
2.3 Preparing for Setup ............................................................................................................20
Choosing a Setup Location ...............................................................................................20
Rack Precautions ..............................................................................................................21
Server Precautions ............................................................................................................21
Rack Mounting Considerations .........................................................................................21
Ambient Operating Temperature ....................................................................................21
Airow ............................................................................................................................22
Mechanical Loading .......................................................................................................22
Circuit Overloading ........................................................................................................22
Reliable Ground .............................................................................................................22
2.4 Installing the Rails ..............................................................................................................23
Identifying the Rails .........................................................................................................23
Releasing the Inner Rail....................................................................................................24
Installing the Inner Rails ...................................................................................................25
Installing the Outer Rails onto the Rack ...........................................................................26
2.5 Installing the Chassis into a Rack ......................................................................................27
Removing the Chassis from the Rack ..............................................................................28
5
Contents
Chapter 3 Maintenance and Component Installation
3.1 Removing Power ................................................................................................................29
3.2 Accessing the System ........................................................................................................30
Removing the Top Cover ...............................................................................................30
3.3 Static-Sensitive Devices .....................................................................................................31
Precautions .......................................................................................................................31
3.4 Processor and Heatsink Installation ...................................................................................32
The Processor Carrier Assembly ......................................................................................33
The Processor Heatsink Module (PHM) ...........................................................................35
Preparing the CPU Socket for Installation ........................................................................36
Installing the PHM into the CPU Socket ...........................................................................37
Removing the PHM from the CPU Socket .......................................................................39
Removing the Processor Carrier Assembly from the PHM ..............................................40
Removing the Processor from the Processor Carrier Assembly ......................................41
3.5 Memory ...............................................................................................................................42
Memory Support ................................................................................................................42
Memory Installation Sequence ..........................................................................................42
General Memory Population Requirements ......................................................................42
Guidelines Regarding Mixing DIMMs ............................................................................43
DDR4 Memory Population Guidelines ..............................................................................44
Optane PMem 200 Series .................................................................................................45
PMem Notes ..................................................................................................................46
DIMM Installation ..............................................................................................................47
DIMM Removal .................................................................................................................47
3.6 Motherboard Battery ...........................................................................................................48
3.7 Storage Drives ....................................................................................................................49
Checking the Temperature of an NVMe Drive ..................................................................49
Installing Drives .................................................................................................................49
Hot-Swap for NVMe Drives ...............................................................................................52
Installing M.2 Solid State Drives .......................................................................................53
Installing M.2 Drives ......................................................................................................53
3.8 System Cooling ..................................................................................................................54
Fans ..................................................................................................................................54
Air Shrouds .......................................................................................................................55
6
Contents
3.9 Expansion Cards ................................................................................................................56
Riser Cards .......................................................................................................................56
Installing Expansion Cards ............................................................................................58
3.10 Power Supply ....................................................................................................................59
3.11 BMC ..................................................................................................................................60
Chapter 4 Motherboard Connections
4.1 Power Connections ............................................................................................................61
4.2 Headers and Connectors ...................................................................................................62
Control Panel .................................................................................................................65
Front Control Panel LEDs .................................................................................................65
4.3 Input/Output Ports ..............................................................................................................69
Front I/O Ports ...............................................................................................................69
4.4 Jumpers ..............................................................................................................................70
4.5 LED Indicators ....................................................................................................................71
4.6 Storage Ports .....................................................................................................................72
Chapter 5 Software
5.1 Microsoft Windows OS Installation .....................................................................................73
5.2 Driver Installation ................................................................................................................75
5.3 SuperDoctor® 5 ...................................................................................................................76
5.4 BMC ....................................................................................................................................77
BMC ADMIN User Password ............................................................................................77
Chapter 6 Optional Components
6.1 Storage Protocols Supported .............................................................................................78
6.2 Power Supply Modules .......................................................................................................78
6.3 Cable Management Arm.....................................................................................................79
6.4 TPM Security Module .........................................................................................................81
6.5 Intel Virtual RAID on CPU (VROC) ....................................................................................82
Requirements and Restrictions .........................................................................................82
Supported SSDs and Operating Sytems ..........................................................................82
Additional Information .......................................................................................................83
Hardware Key ...................................................................................................................83
Conguring NVMe RAID Manually ....................................................................................84
Status Indications ..............................................................................................................89
7
Contents
Hot-Swap Drives ...............................................................................................................89
Hot-unplug .....................................................................................................................89
Hot-plug .........................................................................................................................89
Related Information Links .................................................................................................89
Chapter 7 Troubleshooting and Support
7.1 Information Resources ........................................................................................................90
Website .............................................................................................................................90
Direct Links for the SYS-220HE-FTNR/220HE-FTNRD System ...................................90
Direct Links for General Support and Information .......................................................90
7.2 Baseboard Management Controller (BMC) .........................................................................91
7.3 Troubleshooting Procedures ..............................................................................................92
No Power ..........................................................................................................................92
No Video ...........................................................................................................................93
System Boot Failure .........................................................................................................93
Memory Errors ..................................................................................................................93
Losing the System's Setup Conguration .........................................................................93
When the System Becomes Unstable ..............................................................................93
7.4 BIOS Error Beep (POST) Codes .......................................................................................95
Additional BIOS POST Codes ..........................................................................................95
7.5 Crash Dump Using BMC .....................................................................................................96
7.6 UEFI BIOS Recovery .........................................................................................................97
Overview ...........................................................................................................................97
Recovering the UEFI BIOS Image ....................................................................................97
Recovering the Main BIOS Block with a USB Device ......................................................97
7.7 CMOS Clear .....................................................................................................................102
7.8 BMC Reset .......................................................................................................................102
7.9 Where to Get Replacement Components ........................................................................103
7.10 Reporting an Issue ..........................................................................................................103
Technical Support Procedures ........................................................................................103
Returning Merchandise for Service .................................................................................103
Vendor Support Filing System ........................................................................................104
7.11 Feedback ..........................................................................................................................104
7.12 Contacting Supermicro ....................................................................................................105
8
Contents
Appendix A Standardized Warning Statements for AC Systems
Appendix B Standardized Warning Statements for DC Systems
DC Power Disconnection ................................................................................................144
Hazardous Voltage or Energy Present on DC Power Terminals ....................................146
Appendix C System Specications
BSMI/RoHS .............................................................................................................................151
9
Contacting Supermicro
Contacting Supermicro
Headquarters
Address: Super Micro Computer, Inc.
980 Rock Ave.
San Jose, CA 95131 U.S.A.
Tel: +1 (408) 503-8000
Fax: +1 (408) 503-8008
Email: marketing@supermicro.com (General Information)
Sales-USA@supermicro.com (Sales Inquiries)
Government_Sales-USA@supermicro.com (Gov. Sales Inquiries)
support@supermicro.com (Technical Support)
RMA@supermicro.com (RMA Support)
Webmaster@supermicro.com (Webmaster)
Website: www.supermicro.com
Europe
Address: Super Micro Computer B.V.
Het Sterrenbeeld 28, 5215 ML
's-Hertogenbosch, The Netherlands
Tel: +31 (0) 73-6400390
Fax: +31 (0) 73-6416525
Email: Sales_Europe@supermicro.com (Sales Inquiries)
Support_Europe@supermicro.com (Technical Support)
RMA_Europe@supermicro.com (RMA Support)
Website: www.supermicro.nl
Asia-Pacic
Address: Super Micro Computer, Inc.
3F, No. 150, Jian 1st Rd.
Zhonghe Dist., New Taipei City 235
Taiwan (R.O.C)
Tel: +886-(2) 8226-3990
Fax: +886-(2) 8226-3992
Email: Sales-Asia@supermicro.com.tw (Sales Inquiries)
Support@supermicro.com.tw (Technical Support)
RMA@supermicro.com.tw (RMA Support)
Website: www.supermicro.com.tw
10
Chapter 1: Introduction
Chapter 1
Introduction
1.1 Overview
This chapter provides a brief outline of the functions and features of the SuperServer®
SYS-220HE-FTNR/220HE-FTNRD. It is based on the X12DHM-6 motherboard and the
CSE-HE211-R000NFP chassis.
The following provides an overview of the specications and capabilities.
System Overview
Motherboard X12DHM-6
Chassis CSE-HE211-R000NFP
Processor
Support Dual 3rd Generation Intel® Xeon® Scalable processors
Memory 32 DIMM slots for up to 8TB 3DS ECC DDR4-3200:LRDIMM/RDIMM or 8TB Intel®
Optane™ DDR4-3200:DCPMM, LRDIMM/RDIMM//DCPMM
Drive Support Six 2.5" hot-swap NVMe/SATA hybrid drive bays
Two M.2 PCIe 3.0 p10-x4 NVMe/SATA hybrid slots (with support for M-Key 2280 and 22110)
Expansion Slots
Three PCIe 4.0 x16 FHFL (10.5") and two PCIe 4.0 p10-x8 FHHL or six PCIe 4.0 p10-x8 FHFL
(10.5") and two PCIe 4.0 p10-x8 FHHL.
Two AIOM (Advanced I/O Module) PCIe 4.0 x16 slots
I/O Ports
One RJ45 Dedicated BMC LAN port
Two USB 3.0 port(s) (2 Front)
One VGA port(s)
System Cooling Six 6-cm heavy duty fans with optimal fan speed control
Power SYS-220HE-FTNR: 2000W Redundant AC Power Supplies with PMBus
SYS-220HE-FTNRD: 1300W Redundant DC -48V Power Supplies with PMBus
Form Factor 2U Rackmount 3.5 x 17.2 x 22.6in. / 89 x 437 x 574mm (HxWxD)
Notes: A Quick Reference Guide can be found on the product page of the Supermicro website.
The following safety models associated with the SYS-220HE-FTNR/220HE-FTNRD have
been certied as compliant with UL or CSA: HE211-13D, HE211-R13DX12, HE211-20, HE211-
R20X12, HE211-12, HE211-R12X12.
11
Chapter 1: Introduction
1.2 System Features
The following views of the system display the main features. Refer to Appendix C for additional
specications.
Front View
Figure 1-1. Front View (SYS-220HE-FTNR shown above)
Figure 1-2. Front View (SYS-220HE-FTNRD shown above)
Control Panel
BMC LAN Port
Power Supply Power Supply VGA Port
USB Ports
5
8
6
7
A1
1
2
3
4
A2
Control Panel
BMC LAN Port
VGA Port
USB Ports
5
8
6
7
A1
1
2
3
4
A2
Power Supply
(PWS1)
Power Supply
(PWS2)
Note: see the following page for details on the features shown above.
12
Chapter 1: Introduction
Power Supply Indicators
Power Supply Condition Green LED Amber LED
No Power to Power Supply OFF OFF
Power Supply critical events causing a
shutdown/ failure/ OCP/ OVP/ Fan Fail/
OTP/ UVP
OFF Amber LED
Power Supply Warning Events Where the
power supply continues to operate; High
temperature; Over voltage; under voltage,
etc.
OFF 1Hz Blink Amber
AC or DC present only 12VSB ON (PS
OFF) 1Hz Blink Green OFF
Output ON and OK Green OFF
One of the power cords unplugged and in
redundant mode OFF Amber
System Features: Front
Feature Description
Power Supplies
Two (redundant) power supply modules, PWS1, and PWS2 on the left
SYS-220HE-FTNR: 2000W AC Power Supplies with PMBus
SYS-220HE-FTNRD: 1300W DC Power Supplies with PMBus
USB Two USB 3.0 ports
BMC LAN Port One RJ45 dedicated BMC LAN port
VGA Port One Video port
Control Panel One control panel (see for details)Control Panel
A1 AIOM/OCP NIC 3.0 Slot
A2 AIOM/OCP NIC 3.0 Slot
1 – 4
1 - PCIe 4.0 x16 Slot (FH, 10.5”L) or PCIe 4.0 p12-x8 (in x16) Slot
2 - Optional: PCIe 4.0 x8 (in x16) Slot (FH, 10.5”L, slot 2 is disabled if slot 1 is congured as
PCIe 4.0 x16)
3 - PCIe 4.0 x16 Slot (FH, 10.5”L) or PCIe 4.0 p12-x8 (in x16) Slot
4 - Optional: PCIe 4.0 x8 (in x16) Slot (FH, 10.5”L, slot 4 is disabled if slot 3 is congured as
PCIe 4.0 x16)
5 – 8
5 - PCIe 4.0 x16 Slot (FHFL 10.5”) or PCIe 4.0 p12-x8 (in x16) Slot
6 - Optional: PCIe 4.0 x8 (in x16) Slot (FHFL 10.5”). Slot 6 is disabled if slot 5 is congured
as PCIe 4.0 x16)
7 - PCIe 4.0 p12-x8 (in x16) Slot (FHHL)
8 - PCIe 4.0 p12-x8 (in x16) Slot (FHHL)
13
Chapter 1: Introduction
Control Panel Features
Feature Description
Power button The main power switch applies or removes primary power from the power supply to the server
but maintains standby power.
UID button/LED
BMC button
The unit identication (UID) button turns on or o󰀨 the blue light function of the Information
LED and a blue LED on the rear of the chassis.
This button can also be used to reset the BMC. See Chapter 3.
Power LED Indicates power is being supplied to the system power supply units. This
LED is illuminated when the system is operating normally.
HDD Indicates activity on the storage drives when ashing.
NIC (LAN1) LED Indicates network activity on LAN1 when ashing.
NIC (LAN2) LED Indicates network activity on LAN2 when ashing.
Power Fail LED Indicates a power supply module has failed.
Information LED Alerts operator to several states, as noted in the table below.
Information LED
Status Description
Continuously ON and
red
An overheat condition has occurred.
(This may be caused by cable congestion.)
Blinking red (1Hz) Fan failure, check for an inoperative fan.
Blinking red (0.25Hz) Power failure, check for a non-operational power
supply.
Solid blue UID has been activated locally to locate the
server in a rack environment.
Blinking blue UID has been activated using the BMC to locate
the server in a rack environment.
Control Panel
Figure 1-3. Control Panel
Power
Power LED
Information LED
UID Button/LED
BMC Reset
HDD
NIC (LAN1) LED
NIC (LAN2) LED
Power Fail LED
14
Chapter 1: Introduction
Rear View
Figure 1-4. System: Rear View
System Features: Rear
Feature Description
System Fans Six 6cm heavy duty fans with optimal fan speed control
1 2 3450
Logical Storage Drive Numbers
Item Description
0 – 32.5' hot-swap 2.5" NVMe Gen4/SATA3 drive bays (NVMe from CPU1)
4 – 52.5' hot-swap 2.5" NVMe Gen4/SATA3 drive bays (NVMe from CPU2)
15
Chapter 1: Introduction
Figure 1-5. Main Component Locations
1.3 System Architecture
This section covers the locations of the system's main components, a system block diagram,
and a motherboard layout with the connectors and jumpers called out.
Main Components
Heatsinks
Storage
Backplane
Dual 3rd Gen
Intel® Xeon®
Scalable
Processors up
to 270W
Six Internal
Fans
DIMM Slots
16
Chapter 1: Introduction
System Features: Top
Feature Description
Heatsinks Two Heatsinks on two CPUs.
Storage Backplane Disk-on-Module port allows for ashcards to be mounted directly on the motherboard.
DIMM Slots 32 DIMM slots
Processors Dual 3rd Gen Intel® Xeon® Scalable Processors up to 270W
System Fans Six internal systems fans
Memory Slots 32 DIMM slots DDR4
17
Chapter 1: Introduction
System Block Diagram
The block diagram below shows the connections and relationships between the subsystems
and major components of the overall system.
Figure 1-6. System Block Diagram
P1E
Vc n s V ioci /V a/ cc
#1#2 PE2
CH4
X12DHM-6
UP0
#2
#2
DDR4 DIMM
DDR4 DIMM
P1F
PE1
P2D
#2 UPI0 #1
P2H
PE3
CH0
P2EP1D
CH1
NVMe2
UPI2
NVMe3
CH0
PE0
CH6
UPI3
P1A
PCIe Gen4 p17-x16 (64GB/s)
CP #2U
#1
CH2
CH5
#1
PCIe Gen4 p17-x16 (64GB/s)
#2
PCIe Gen4 p17-x16 (64GB/s)
PE3
P2C
DDR4 DIMM
#3
DDR4 DIMM
DDR4 DIMM
#1
DDR4 DIMM
#2
CH3
UPI2
CH1
#2
CH2
Processor 2
#3
P2B
CH7
PCH
#2
P2F
CH4
PCIe Gen4 p17-x16 (64GB/s)
100MHZ
DDR4 DIMM
CLOCK
BU ERFF
Polarity Inversion
VR .HC13
UPI 10.4GT/s (Min), 11.2GT/s (Tar)
#1
CH6
UPI 10.4GT/s (Min), 11.2GT/s (Tar)
Processor 1
CH7
DDR4 DIMM
P1C
#1
P1B
#2
#1#1
#2
UPI3
UPI1
#1
#2
DDR4 DIMM
#3
#1
DDR4 DIMM
PE1
DMI
PCIe Gen4 p17-x16 (64GB/s)
DMI Gen3 p17-x4 (8GB/s)
PE2
CH3
P1H
DDR4 DIMM
DDR4 DIMM
#1
P1G
NVMe4
UPI 10.4GT/s (Min), 11.2GT/s (Tar)
PE0
#3
CH5
A2PG2P
PCIe Gen4 p17-x16 (64GB/s)
PCIe Gen4 p17-x16 (64GB/s)
PCIe Gen4 p17-x16 (64GB/s)
JSLOT2A,
SlimSAS LP
CONN
AIOM1
Gen 4C+ CONN
JSLOT1
Gen Z 4C
CONN
JSLOT4
Gen Z 4C
CONN AIOM2A,
AIOM2B
JSLOT3A,
JSLOT3B
DDR4 DDR4
UART
SPI1
NCSI
BMC
MEM YOR
VGA 1920x1200 32bpps 60Hz
PHY
AST2600
IO CONN
PHY
RTL8211F
Vc n s V ioci /V a/ cc
VR .HC13
CP #1U
BMC
32MB Flash
4Mbit
BIOS/TPM
32MB Flash
Con Memory
CPLD
NAND Flash
4Gbit
CPLD
UID BUTTON
LCMXO3LF-6900C-6BG324C
CPLD
FIRMWAVE SPI
LAN
VGA
COM
USB3
SlimSAS
CONN
FOR S AAT
x8 PORT
JUSB3
eSPI
LPC/eSPI
USB
eICP
SATA Gen3 [0..7]
USB3.0[3..4]
M2_A CONN
SlimSA CONNS LP
FOR NVMe p17-x8 PORT
NVMe1
SlimSAS LP CONN
FOR NVMe p17-x8 PORT
SlimSA CONNS LP
FOR NVMe p17-x8 PORT SlimSAS LP CONN
FOR NVMe p17-x8 PORT
PCIe Gen3 [4..7]
S-SATA Gen3 [2]
PCIe Gen3 [8..11]
S-SATA Gen3 [1]
USB2.0 [6,7]
UID
USB 2.0
J45
USB 2.0 OCP CONN
FOR AIOM2 AIOM2 OCP SIDEBAND
AIOM1 OCP SIDEBAND
AIOM1 OCP SIDEBAND
SATA G3 x1
SATA G3 x1
PCIe Gen3 x2
SATA 6Gb/s
USB 3.0
USB 3.0 USB3.0[3..4]
BIOS SPI BIOs SPI
BMC SPI1
BMC SPI
MDI
DMI
AIOM1 OCP SIDEBAND
NCSI
NCSI
USB3.0 x 2
J48
JS1
M2_B CONN
DDR4 DIMM
#2 #2
DDR4 DIMM
DDR4 DIMM
#2 2#
DDR4 DIMM
#2
Clock
So e D 00 So e D 01ck tI ck tI
PCIe [5]
Up to 3200 MHz
Up to 3200 MHz
Up to 3200 MHz
Up to 3200 MHz
Up to 3200 MHz
Up to 3200 MHz
Up to 3200 MHz
Up to 3200 MHz
Up to 3200 MHz
Up to 3200 MHz
Up to 3200 MHz
Up to 3200 MHz
Up to 3200 MHz
Up to 3200 MHz
Up to 3200 MHz
Up to 3200 MHz
Intel C621A
SlimSAS LP
CONN
SlimSAS LP
CONN
JSLOT2B
USB 2.0
UART
eSPI
PCIe Gen 1
UPI1
PCIe Gen3 x2
OCP SIDEBAND
19
Chapter 1: Introduction
Quick Reference Table
Jumper Description Default Setting
JBT1 CMOS clear Open (Normal)
Connector Description
BT1 Onboard CMOS battery
FAN1 ~ FAN8 6-pin system cooling fan headers
FAN9 ~ FAN10 4-pin CPU cooling fan headers
JAIOM1 The Supermicro® Advanced I/O Module (AIOM) slot
JF3_JIPMB1 6-pin BMC external I2C header (for an BMC card)
JFP1 Front control panel header
JFP2 Front VGA header
JGPW1~5 8-pin power connector
JIO1 Low-prole slimSAS 8x I/O connector
JL1 Chassis intrusion header
JNVI2C1 NVMe SMBus (I2C) headers used for PCIe hot-plug SMBus clock and data connections
JNVVPP1 CPU VPP bus header for backplane NVMe riser card device
JPCIE1, JPCIE4 CPU PCIe 4.0 x16 slots
JPCIE2A1, JPCIE2B1,
JPCIE3A1, JPCIE3B1,
JPCIE5A1, JPCIE5B1
CPU PCIe 4.0 p19-x8 slots
JPRG1 Complex Programmable Logical Device (CPLD) header
JPWR1, JPWR4 6-pin power connector
JRSI2C1 SMBus header for riser card
JS1 I-SATA 0~7 connector
JTPM1 Trusted Platform Module/Port 80 Connector
JUID1 Multi-purpose UID switch and reset switch
JUSB3 USB 3.0 header (supports two USB 3.0 ports)
JVRM1 VRM SMB clock to BMC
M.2-H1/M.2-H2 M.2 PCIe 3.0 p19-x2 or SATA 3.0 hybrid slots (Supports M-Key 2280 and 22110) supported by
PCH
P1_NVME0/P1_NVME1/P2_
NVME0/P2_NVME1
NVMe PCIe 4.0 p19-x4 ports ( : When installing an NVMe device on a motherboard, please Note
be sure to connect JNVME0 rst for your system to work properly.)
PSU1~2 Power supply unit connectors
VROC (JRK1) Intel VROC RAID key header for NVMe SSD
LED Description Status
LEDM1 BMC Heartbeat LED Blinking Green: BMC Normal
LED1 Unit Identier (UID) LED Solid Blue: Unit Identied
LED2 System Power LED LED On: Onboard Power On
20
Chapter 2: Server Installation
Chapter 2
Server Installation
2.1 Overview
This chapter provides advice and instructions for mounting your system in a server rack. If
your system is not already fully integrated with processors, system memory, etc., refer to
Chapter 3 for details on installing those specic components.
Caution: Electrostatic Discharge (ESD) can damage electronic components. To prevent such
damage to PCBs (printed circuit boards), it is important to use a grounded wrist strap, handle
all PCBs by their edges and keep them in anti-static bags when not in use.
2.2 Unpacking the System
Inspect the box in which the system was shipped, and note if it was damaged in any way.
If any equipment appears damaged, le a damage claim with the carrier who delivered it.
Decide on a suitable location for the rack unit that will hold the server. It should be situated
in a clean, dust-free area that is well ventilated. Avoid areas where heat, electrical noise,
and electromagnetic elds are generated. It will also require a grounded AC or DC power
outlet nearby. Be sure to read the precautions and considerations noted or in Appendix A or
Appendix B respectively.
2.3 Preparing for Setup
The box in which the system was shipped should include the rackmount hardware needed to
install it into the rack. Please read this section in its entirety before you begin the installation.
Choosing a Setup Location
• The system should be situated in a clean, dust-free area that is well ventilated. Avoid areas
where heat, electrical noise, and electromagnetic elds are generated.
• Leave enough clearance in front of the rack so that you can open the front door completely
(~25 inches) and approximately 30 inches of clearance in the back of the rack to allow
su󰀩cient space for airow and access when servicing.
• This product should be installed only in a Restricted Access Location (dedicated equipment
rooms, service closets, etc.).
21
Chapter 2: Server Installation
• This product is not suitable for use with visual display workplace devices according to §2
of the German Ordinance for Work with Visual Display Units.
Rack Precautions
• Ensure that the leveling jacks on the bottom of the rack are extended to the oor so that
the full weight of the rack rests on them.
• In single rack installations, stabilizers should be attached to the rack. In multiple rack in-
stallations, the racks should be coupled together.
• Always make sure the rack is stable before extending a server or other component from
the rack.
• You should extend only one server or component at a time - extending two or more simul-
taneously may cause the rack to become unstable.
Server Precautions
• Review the electrical and general safety precautions in Appendix A or Appendix B.
• Determine the placement of each component in the rack you install the rails.before
• Install the heaviest server components at the bottom of the rack rst and then work your
way up.
• Use a regulating uninterruptible power supply (UPS) to protect the server from power
surges and voltage spikes and to keep your system operating in case of a power failure.
• Allow any drives and power supply modules to cool before touching them.
• When not servicing, always keep the front door of the rack and all covers/panels on the
servers closed to maintain proper cooling.
Rack Mounting Considerations
Ambient Operating Temperature
If installed in a closed or multi-unit rack assembly, the ambient operating temperature of
the rack environment may be greater than the room's ambient temperature. Therefore,
consideration should be given to installing the equipment in an environment compatible with
the manufacturer’s maximum rated ambient temperature (TMRA).
22
Chapter 2: Server Installation
Airow
Equipment should be mounted into a rack so that the amount of airow required for safe
operation is not compromised.
Mechanical Loading
Equipment should be mounted into a rack so that a hazardous condition does not arise due
to uneven mechanical loading.
Circuit Overloading
Consideration should be given to the connection of the equipment to the power supply circuitry
and the e󰀨ect that any possible overloading of circuits might have on overcurrent protection
and power supply wiring. Appropriate consideration of equipment nameplate ratings should
be used when addressing this concern.
Reliable Ground
A reliable ground must be maintained at all times. To ensure this, the rack itself should be
grounded. Particular attention should be given to power supply connections other than the
direct connections to the branch circuit (i.e. the use of power strips, etc.).
To prevent bodily injury when mounting or servicing this unit in a rack, you must take
special precautions to ensure that the system remains stable. The following guidelines
are provided to ensure your safety:
• This unit should be mounted at the bottom of the rack if it is the only unit in the rack.
• When mounting this unit in a partially lled rack, load the rack from the bottom to the top
with the heaviest component at the bottom of the rack.
• If the rack is provided with stabilizing devices, install the stabilizers before mounting or
servicing the unit in the rack.
• Slide rail mounted equipment is not to be used as a shelf or a workspace.
Warning: Do not pick up the server with the front handles. They are designed to pull
the system from a rack only.
Slide rail mounted equipment is not to be used as a shelf or a workspace.
23
Chapter 2: Server Installation
2.4 Installing the Rails
This section provides information on installing the chassis into a rack unit with the rails
provided. There are a variety of rack units on the market, which may mean that the assembly
procedure will dier slightly from the instructions provided. You should also refer to the
installation instructions that came with the rack unit you are using. Note: This rail will t a
rack between 26.8" and 36.4" deep.
Identifying the Rails
The chassis package includes two rail assemblies. Each assembly consists of three sections:
An inner rail that secures directly to the chassis, an outer rail that secures to the rack, and
a middle rail which extends from the outer rail. These assemblies are specically designed
for the left and right side of the chassis and labeled.
Figure 2-1. Identifying the Outer Rail, Middle Rail and Inner Rail
(Left Rail Assembly Shown)
Note: Both front chassis rails and the rack rails have a locking tab, which serves two functions.
First, it locks the server into place when installed and pushed fully into the rack (its normal
operating position. In addition, these tabs lock the server in place when fully extended from
the rack. This prevents the server from coming completely out of the rack when pulled out
for servicing.
Middle Rail
Outer Rail
25
Chapter 2: Server Installation
Installing the Inner Rails
Begin the rack mounting procedure by installing the inner rails to the chassis.
1. Identify the left and right inner rails. They are labeled.
2. Place the inner rail rmly against the side of the chassis, aligning the hooks on the side
of the chassis with the holes in the inner rail.
3. Slide the inner rail forward toward the front of the chassis and under the hooks until the
quick release bracket snaps into place, securing the rail to the chassis.
4. Optionally, you can further secure the inner rail to the chassis with a screw.
Figure 2-3. Installing the Rails
Warning: Do not pick up the server with the front handles. They are designed to pull
the system from a rack only.
26
Chapter 2: Server Installation
Figure 2-4. Installing the Outer Rails to the Rack
Installing the Outer Rails onto the Rack
Installing the Outer Rails
1. Press upward on the locking tab at the rear end of the middle rail.
2. Push the middle rail back into the outer rail.
3. Hang the hooks on the front of the outer rail onto the square holes on the front of the
rack. If desired, use screws to secure the outer rails to the rack.
4. Pull out the rear of the outer rail, adjusting the length until it just ts within the posts of
the rack.
5. Hang the hooks of the rear section of the outer rail onto the square holes on the rear of
the rack. Take care that the proper holes are used so the rails are level. If desired, use
screws to secure the rear of the outer rail to the rear of the rack.
6. Repeat for the other outer rail.
Note: The gure above is for illustrative purposes only. Always install servers at the bottom
of the rack rst.
Stability hazard. The rack stabilizing mechanism must be in place, or the rack must
be bolted to the oor before you slide the unit out for servicing. Failure to stabilize the
rack can cause the rack to tip over.
27
Chapter 2: Server Installation
2.5 Installing the Chassis into a Rack
Once rails are attached to the chassis and the rack, you can install the server.
Installing the Chassis into a Rack
1. Extend the outer rails as illustrated above.
2. Align the inner rails of the chassis with the outer rails on the rack.
3. Slide the inner rails into the outer rails, keeping the pressure even on both sides. When
the chassis has been pushed completely into the rack, it should click into the locked
position.
4. Optional screws may be used to hold the front of the chassis to the rack.
Figure 2-5. Installing the Server into the Rack
Note: The gure is for illustrative purposes only. Always install servers to the bottom of a
rack rst.
28
Chapter 2: Server Installation
Removing the Chassis from the Rack
Caution! It is dangerous for a single person to o󰀨-load the heavy chassis from the rack without
assistance. Be sure to have su󰀩cient assistance supporting the chassis when removing it
from the rack. Use a lift.
1. If necessary, loosen the thumbscrews on the front of the chassis that hold it in the rack.
2. Pull the chassis forward out the front of the rack until it stops.
3. Press the release latches on each of the inner rails downward simultaneously and
continue to pull the chassis forward and out of the rack.
Figure 2-6. Removing the Chassis from the Rack
Note: The gure is for illustrative purposes only. Always install servers to the bottom of a
rack rst.
29
Chapter 3: Maintenance and Component Installation
Chapter 3
Maintenance and Component Installation
This chapter provides instructions on installing and replacing main system components. To
prevent compatibility issues, only use components that match the specications and/or part
numbers given.
Installation or replacement of most components requires that power rst be removed from
the system. Please follow the procedures given in each section.
3.1 Removing Power
Use the following procedure to ensure that power has been removed from the system. This
step is necessary when removing or installing non-hot-swap components or when replacing
a non-redundant power supply.
1. Use the operating system to power down the system.
2. After the system has completely shut-down, disconnect the AC or DC power cord(s)
from the power strip or outlet. (If your system has more than one power supply, remove
the AC or DC power cords from all power supply modules.)
3. Disconnect the power cord(s) from the power supply module(s).
30
Chapter 3: Maintenance and Component Installation
Figure 3-1. Removing the Chassis Cover
Release Button
3.2 Accessing the System
The CSE-HE211-R000NFP chassis features a removable top cover, which allows easy access
to the inside of the chassis.
Removing the Top Cover
1. Press the release button and slide the cover toward the rear.
2. Lift the top cover-up.
Check that all ventilation openings on the top cover and the top of the chassis are clear and
unobstructed.
Caution: Except for short periods of time, do not operate the server without the cover in place.
The chassis cover must be in place to allow for proper airow and to prevent overheating.
32
Chapter 3: Maintenance and Component Installation
3.4 Processor and Heatsink Installation
The processor (CPU) must rst be attached to the processor carrier to form the processor
carrier assembly. This assembly gets attached to the heatsink to form the processor heatsink
module (PHM), which is then installed into the CPU socket. Before installing, be sure to
perform the steps below:
• Please carefully follow the instructions given on ESD precautions.
• After shutting down the system, unplug the AC or DC power cords from all power supplies.
• Check that the plastic protective cover is on the CPU socket and that none of the socket
pins are bent. If they are, contact your retailer.
• When handling the processor, avoid touching or placing direct pressure on the LGA lands
(gold contacts). Improper installation or socket misalignment can cause serious damage
to the processor or the socket and may require manufacturer repairs.
• Thermal grease is pre-applied on new heatsinks. No additional thermal grease is needed.
• Refer to the Supermicro website (https://www.supermicro.com/en) for updates on proces-
sor and memory support.
• All graphics in this manual are for illustration only. Your components may look di󰀨erent.
33
Chapter 3: Maintenance and Component Installation
(with Processor Seated inside the Carrier)
The Processor Carrier Assembly
The processor carrier assembly is comprised of the processor and the processor carrier.
To create the processor carrier assembly, please follow the steps below:
Note: Before installation, be sure to review the Static-Sensitive Devices section earlier in
this chapter.
1. Hold the processor with the gold pins (LGA lands) facing down. Locate the gold triangle
at the corner of the processor and the corresponding hollowed triangle on the processor
carrier as shown below. These triangles indicate the location of pin 1.
2. Turn the processor over (with the gold pins up). Locate the CPU keys on the processor
and the four latches on the carrier as shown below.
Latch
Latch
Processor (Reverse Side Up)
Carrier (Top Side Up)
CPU Key
CPU Key
Latch
Latch
Pin 1
Pin 1
35
Chapter 3: Maintenance and Component Installation
Processor Carrier Assembly
Pin1
A
B
C
D
a
b
c
d
Heatsink
The Processor Heatsink Module (PHM)
After creating the processor carrier assembly, follow the instructions below to mount the
heatsink onto the carrier assembly to form the processor heatsink module (PHM).
Note: If this is a new heatsink, the thermal grease has been pre-applied. Otherwise, apply
the proper amount of thermal grease to the underside of the heatsink.
1. Turn the heatsink over with the thermal grease facing up. Pay attention to the two
triangle cutouts (A, B) located at the diagonal corners of the heatsink as shown in the
drawing below.
2. Hold the processor carrier assembly upside-down to locate the triangles on the
processor and the carrier, which indicate pin 1.
3. Turn the processor carrier assembly over so that the gold pins are facing up. Locate the
two-pin 1 locations ("A on the processor and "a" on the processor carrier assembly).
4. Align "a" on the processor carrier assembly with the triangular cutout "A" on the heatsink
along with "b", "c", "d" on the processor assembly with "B", "C", "D" on the heatsink.
5. Once properly aligned, place the heatsink on the processor carrier assembly with all
corners matched up, making sure that the four clips are properly securing the heatsink.
37
Chapter 3: Maintenance and Component Installation
d
a
b
c
A, B, C, D: Peek Nut
1, 2, 3, 4: Rotating Wire
a, b, c, d: Threaded Fastener
Peek Nut
(Unlatched) (latched)
Rotating Wire 3
Peek Nut
A
B
C
D
Rotating Wire 1
2
Rotating Wire
Rotating Wire 4
Threaded Fastener
Heatsink
CPU Socket
Peek Nut
Rotating Wire Side View
Top View
Unlatched State
a
b
c
d
(a, b, c, d: Threaded Fasteners) CPU Socket Pin1
Threaded FastenerCPU Socket
Installing the PHM into the CPU Socket
After assembling the Processor Heatsink Module (PHM), you are ready to install it into the
CPU socket.
1. Locate four threaded fasteners (a, b, c, d) on the CPU socket.
2. Locate four peek nuts (A, B. C. D) and four rotating wires (1, 2, 3, 4) on the heatsink as
shown below.
3. Check the rotating wires (1, 2, 3, 4) to make sure that they are in the unlatched position
as shown.
40
Chapter 3: Maintenance and Component Installation
Removing the Processor Carrier Assembly from the PHM
To remove the processor carrier assembly from the PHM, please follow the steps below:
1. Detach the four plastic clips (marked a, b, c, d) on the processor carrier assembly from
the four corners of the heatsink (marked A, B, C, D) as shown below.
2. When all plastic clips have been detached from the heatsink, remove the processor
carrier assembly from the heatsink.
Pin1 Pin1
A
B
C
D
a
b
c
dProcessor Carrier Assembly
Heatsink
41
Chapter 3: Maintenance and Component Installation
Removing the Processor from the Processor Carrier Assembly
Once you have removed the processor carrier assembly from the PHM, you are ready to
remove the processor from the processor carrier by following the steps below.
1. Unlock the lever from its locked position and push it upwards to disengage the
processor from the processor carrier, as shown below right.
Lever
Processor Carrier Assembly
2. Once the processor has been loosened from the carrier, carefully remove the processor
from the carrier.
Note: Please handle the processor with care to avoid damaging it or its pins.

Produkt Specifikationer

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Model: SuperServer SYS-220HE-FTNR

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